Heat sink for a semiconductor chip device

摘要

A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.

主权项

1. A semiconductor chip device comprising:
a substrate including first and second sides, and an opening extending through the substrate between the first and second sides; first opto-electronic or electronic components mounted on the first and second sides; a heat sink mounted on the first surface in thermal contact with the components on the first side, and including an extension extending through the opening with an exposed surface parallel with the second side; and at least one second opto-electronic or electronic components mounted on the exposed surface of the extension; wherein the heat sink provides a first thermally-conductive path for the first components on the first side and each of the second components on the exposed surface.