Interconnect routing configurations and associated techniques

摘要

Embodiments of the present disclosure are directed toward interconnect routing configurations and associated techniques. In one embodiment, an apparatus includes a substrate, a first routing layer disposed on the substrate and having a first plurality of traces, and a second routing layer disposed directly adjacent to the first routing layer and having a second plurality of traces, wherein a first trace of the first plurality of traces has a width that is greater than a width of a second trace of the second plurality of traces. Other embodiments may be described and/or claimed.

主权项

1. An apparatus comprising:
a substrate; a first routing layer disposed on the substrate and having a first plurality of traces; and a second routing layer disposed directly adjacent to the first routing layer and having a second plurality of traces, wherein a first trace of the first plurality of traces has a width that is greater than a width of a second trace of the second plurality of traces, and a third trace of the first plurality of traces has a width that is less than a width of a fourth trace of the second plurality of traces, and the first trace and the second traces are ground traces, and the third trace is a dummy trace, and the fourth trace is a signal trace.