发明名称 PACKAGING STRUCTURE FOR FOUR-CHANNEL INTEGRATED TUNABLE ARRAY LASER CHIP
摘要 A packaging structure for a four-channel integrated tunable laser array chip (100) comprises a carrier (200), a cryogenic refrigerator (300), a lens assembly (400), an isolator assembly (500), a package (600), a transition ring (700), and a thermistor. The packaging structure for the four-channel integrated tunable laser array chip (100) can realize a flexible tuning upon an active coupling of optical paths and ensure a reasonable switching of optical paths between optical assemblies, thereby improving a coupling efficiency for the optical paths and increasing a transmission distance of a digital signal. Furthermore, a design of a radio frequency circuit ensures integrity of a transmitted signal and reduces loss during the transmission.
申请公布号 WO2017000130(A1) 申请公布日期 2017.01.05
申请号 WO2015CN82680 申请日期 2015.06.29
申请人 HEBEI HYMAX OPTOELECTTRONICS INC. 发明人 LIU, Chao
分类号 H01S5/022 主分类号 H01S5/022
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