| 摘要 |
The invention relates to a method for machining a substrate (18), in particular a packaging material composed of paper, cardboard, plastic, or the like, or a composite material comprising the substrate, by means of at least one laser device (14), comprising at least the following steps: controlling and orienting at least one laser beam (16), which is produced by means of the laser device (14), in order to machine the substrate (18) within at least one machining region (22); producing an air flow (28) in at least a partial region of the machining region (22) in order to at least partially remove exhaust gases, solid particles, dusts, vaporization products, or decomposition products (24) produced by the laser-beam machining from at least said partial region of the machining region (22) and heating at least the partial region of the machining region (22) containing the exhaust gases, solid particles, dusts, vaporization products, and/or decomposition products (24) and/or the air flow (28) to a temperature between 30 °C and 400 °C. The invention further relates to a device for machining a substrate (18), in particular a packaging material composed of paper, cardboard, plastic, or the like, or for machining a composite material comprising the substrate. |
