ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

摘要

An electronic package is provided, which includes: a first circuit structure; a plurality of first electronic elements disposed on a surface of the first circuit structure; at least a first conductive element formed on the surface of the first circuit structure; and a first encapsulant formed on the surface of the first circuit structure and encapsulating the first electronic elements and the first conductive element, with a portion of the first conductive element exposed from the first encapsulant. By directly disposing the electronic elements having high I/O functionality on the circuit structure, the present disclosure eliminates the need of a packaging substrate having a core layer, thereby reducing the thickness of the electronic package. The present disclosure further provides a method for fabricating the electronic package.

主权项

1. An electronic package, comprising:
a first circuit structure having a first surface and a second surface opposite to the first surface; a plurality of first electronic elements disposed on the first surface of the first circuit structure; at least a first conductive element disposed on the first surface of the first circuit structure; and a first encapsulant formed on the first surface of the first circuit structure and encapsulating the first electronic elements and the first conductive element, with a portion of the first conductive element exposed from the first encapsulant.