PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME

摘要

Some embodiments contemplate methods for forming a package structure and a package structure formed thereby. An embodiment method includes depositing a photosensitive dielectric layer on a support structure; forming a first layer on a surface of the photosensitive dielectric layer; exposing the photosensitive dielectric layer to radiation; and after the forming the first layer and the exposing to radiation, developing the photosensitive dielectric layer. The support structure includes an integrated circuit die. The layer has a different removal selectivity than the photosensitive dielectric layer during the developing. According to some embodiments, a thickness uniformity of the photosensitive dielectric layer after developing may be increased, and thickness loss from developing the photosensitive dielectric layer can be reduced.

主权项

1. A method comprising:
depositing a photosensitive dielectric layer on a support structure, the support structure comprising an integrated circuit die; forming a first layer on a surface of the photosensitive dielectric layer; exposing the photosensitive dielectric layer to radiation to form exposed and unexposed portions of the photosensitive dielectric layer; and after the forming the first layer and the exposing to radiation, developing the photosensitive dielectric layer by applying a developer, the first layer having a different removal selectivity than the photosensitive dielectric layer during the developing, wherein developing the photosensitive dielectric layer comprises removing one of either the exposed or the unexposed portions of the photosensitive dielectric layer.