| 发明名称 |
VERTICAL SHIELDING AND INTERCONNECT FOR SIP MODULES |
| 摘要 |
Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient. |
| 申请公布号 |
WO2016154494(A4) |
申请公布日期 |
2017.01.05 |
| 申请号 |
WO2016US24110 |
申请日期 |
2016.03.24 |
| 申请人 |
APPLE INC. |
发明人 |
HOANG, Lan H.;KATAHIRA, Takayoshi;LIU, Chang |
| 分类号 |
H01L23/00;H01L23/498;H01L23/552;H01L25/065;H01L25/11;H01L25/16 |
主分类号 |
H01L23/00 |
| 代理机构 |
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