SEMICONDUCTOR APPARATUS, SOLID-STATE IMAGE SENSING APPARATUS, AND CAMERA SYSTEM

摘要

A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

主权项

1. An imaging device comprising:
a first substrate including:
a pixel array including a plurality of pixels arranged in rows and columns, a pixel of the plurality of pixels being configured to receive incident light and output an analog signal,a plurality of signal lines, a signal line of the plurality of signal lines being configured to convey the analog signal,a first plurality of via holes disposed along a first side of the pixel array, anda second plurality of via holes disposed along a second side of the pixel array, the second side being perpendicular to the first side; and a second substrate including:
a column circuit including a plurality of comparators and a plurality of counters, anda row control unit configured to output a control signal to at least one of the second plurality of via holes, wherein a comparator of the plurality of comparators is configured to receive the analog signal through at least one of the first plurality of via holes, and the first substrate and the second substrate are bonded together.