| 发明名称 |
Semiconductor Package System and Method |
| 摘要 |
A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings. A redistribution layer can also be formed to extend over the encapsulant, and the first die may be separated from the second die. |
| 申请公布号 |
US2017005049(A1) |
申请公布日期 |
2017.01.05 |
| 申请号 |
US201615268739 |
申请日期 |
2016.09.19 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Huang Hui-Min;Lin Chih-Wei;Tsai Tsai-Tsung;Cheng Ming-Da;Liu Chung-Shi;Yu Chen-Hua |
| 分类号 |
H01L23/00;H01L23/48;H01L21/56;H01L23/31 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor die with a first sidewall; a first protective layer over the semiconductor die, wherein a second sidewall of the first protective layer is recessed from the first sidewall of the semiconductor die; an opening through the first protective layer; an encapsulant covering the first sidewall and the second sidewall, wherein the encapsulant has a top surface that is planar with the first protective layer; and a conductive material filling the opening and extending over the encapsulant. |
| 地址 |
Hsin-Chu TW |
