METHOD TO REDUCE RESISTANCE FOR A COPPER (CU) INTERCONNECT LANDING ON MULTILAYERED METAL CONTACTS, AND SEMICONDUCTOR STRUCTURES FORMED THEREFROM

摘要

A method of forming a semiconductor structure includes forming a first insulating layer containing a first metal layer embedded therein and on a surface of a semiconductor substrate. The method further includes forming an inter-layer dielectric (ILD) layer on the first insulating layer, and forming at least one via trench structure including a first metallization trench and a via in the ILD layer. In addition, the method also includes depositing a metal material to form a first metallization layer in the first metallization trench, a via contact in the via, and a second metal layer on top of at least a portion of the first metal layer in the opening of the first insulating layer. The first metal layer and the second metal layer constitute a multilayer metal contact located in the opening of the first insulating layer.

主权项

1. A method of forming a semiconductor structure comprising:
forming a first insulating layer containing a first metal layer embedded within an opening thereof and on a surface of a semiconductor substrate; forming an inter-layer dielectric (ILD) layer on the first insulating layer; forming at least one via trench structure in the ILD layer, wherein the at least one via trench includes a first metallization trench and a via; and depositing a metal material on the ILD layer to form a first metallization layer including a first portion of the metal material in the first metallization trench, a via contact including a second portion of the metal material in the via, and a second metal layer including a third portion of the metal material on top of at least a portion of the first metal layer in the opening of the first insulating layer, wherein the first metal layer and the second metal layer constitute a multilayer metal contact located in the opening of the first insulating layer.