| 发明名称 |
Flat No-Leads Package With Improved Contact Pins |
| 摘要 |
According to an embodiment of the present disclosure, a leadframe for an integrated circuit (IC) device may comprise a center support structure for mounting an IC chip, a plurality of pins extending from the center support structure, and a bar connecting the plurality of pins remote from the center support structure. Each pin of the plurality of pins may include a dimple. |
| 申请公布号 |
US2017005030(A1) |
申请公布日期 |
2017.01.05 |
| 申请号 |
US201615263030 |
申请日期 |
2016.09.12 |
| 申请人 |
Microchip Technology Incorporated |
发明人 |
Kitnarong Rangsun;Punyapor Prachit;Kenganantanon Ekgachai |
| 分类号 |
H01L23/495;H01L21/56;H01L21/78;H01L23/31;H01L21/66;H01L21/288;H05K3/34;H01L23/00;H01L21/48 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
Chandler AZ US |
