发明名称 ELECTROPLATING SOLUTION ANALYZER, AND ELECTROPLATING SOLUTION ANALYSIS METHOD
摘要 This electroplating solution analyzer comprises: an analysis container that accommodates, as an analysis sample, electroplating solution containing additives that include promoters and suppressors, a working electrode that is immersed in the electroplating solution accommodated in the analysis container, and that performs electron transfer, a reference electrode that is immersed in the electroplating solution accommodated in the analysis container, and that serves as a reference when determining the potential of the working electrode, a counter electrode that is immersed in the electroplating solution accommodated in the analysis container, a rotary drive unit that rotates the working electrode at a constant speed, a current generator that applies a current having a constant current density between the working electrode and the counter electrode, a potential measuring unit that uses chronopotentiometry to measure the potential between the working electrode and the reference electrode, and an analysis unit which, in one or more measurement intervals in the elapsed time from when the current was initially applied, calculates a determination analysis value having a potential change rate and/or an average potential, and determines the condition of the electroplating solution by evaluating the determination analysis value on the basis of preset determining conditions.
申请公布号 WO2017002748(A1) 申请公布日期 2017.01.05
申请号 WO2016JP68970 申请日期 2016.06.27
申请人 TOPPAN PRINTING CO., LTD. 发明人 KOSUGI Masahiro;OKUBO Toshikazu
分类号 G01N27/416;G01N27/28;G01N27/42 主分类号 G01N27/416
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