LOW PROFILE MAGNETORESISTIVE IMAGING SENSOR ARRAY

摘要

A low profile magnetoresistive imaging sensor array based on the principle of magnetic induction, which reduces a distance between a medium imaging sensor array and a medium by optimizing the arrangement of an application integrated circuit and a sensing element array and using an electric connection technology which can reduce the distance between the medium imaging sensor array and the medium, thereby increasing the resolution of the existing medium imaging sensor. The low profile magnetoresistive imaging sensor array comprises a sensing element array and an application integrated circuit, and also comprises a circuit which provides a power for the sensing element array, a magnetoresistive sensing element array selection circuit, a signal amplification circuit, a digitizer, a memory circuit, and a microprocessor. Additionally, the sensing element array comprises at least one magnetoresistive sensing element.

主权项

1. A low profile magnetoresistive imaging sensor array, for reading an image from a medium carrying a magnetic mark, and comprising an electronic subassembly, wherein the electronic subassembly comprises:
a) at least one sensing element array, and the sensing element array comprising at least one magnetoresistive sensing element; b) at least one sensing element array substrate, each sensing element array being located on a top surface of one sensing element array substrate, and each sensing element array substrate further comprising a bottom surface; c) an induction plane, the induction plane passing through the geometric center of the sensing element array and being parallel to the top surface of the sensing element array substrate; and d) a system circuit network, the system circuit network comprising one or more application integrated circuits electronically connected to the sensing element array; wherein in a direction toward the medium, the electronic subassembly has a maximum extension plane parallel to the induction plane, a maximum extension distance is formed between the induction plane and the maximum extension plane, and by means of the position arrangement and electric connection of the integrated circuit and the sensing element array substrate that reduces the maximum extension distance, the maximum extension distance is made to be less than or equal to 150 μm.