MANUFACTURING METHOD FOR ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, MASK BLANK COMPRISING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PHOTO MASK, FORMING METHOD FOR PATTERN, MANUFACTURING METHOD FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

摘要

A manufacturing method for an actinic ray-sensitive or radiation-sensitive resin composition that contains a resin, an acid generator, an organic acid, and a solvent, includes at least one of (i), (ii), or (iii) below, and a content ratio of the organic acid in the actinic ray-sensitive or radiation-sensitive resin composition is greater than 5% by mass based on a total solid content in the composition; (i) dissolving the organic acid in a solution that does not substantially contain the resin and the acid generator, (ii) dissolving the organic acid in a solution that contains the acid generator and does not substantially contain the resin, and (iii) dissolving the organic acid in a solution that contains the resin and does not substantially contain the acid generator, an actinic ray-sensitive or radiation-sensitive resin composition, an actinic ray-sensitive or radiation-sensitive film, a mask blank including the film, a forming method for a photo mask and a pattern, a manufacturing method for an electronic device, and an electronic device.

主权项

1. A manufacturing method for an actinic ray-sensitive or radiation-sensitive resin composition that contains (A) resin, (B) acid generator, (C) organic acid; and (D) solvent, comprising:
at least one of (i), (ii), or (iii) below, wherein a content ratio of (C) organic acid in the actinic ray-sensitive or radiation-sensitive resin composition is greater than 5% by mass based on a total solid content in the composition, (i) dissolving (C) organic acid in a solution that does not substantially contain (A) resin and (B) acid generator; (ii) dissolving (C) organic acid in a solution that contains (B) acid generator and does not substantially contain (A) resin; and (iii) dissolving (C) organic acid in a solution that contains (A) resin and does not substantially contain (B) acid generator.