| 摘要 |
The present invention relates generally to wall repair compounds such as joint com- pounds, spackling compounds, and the like used to repair imperfections in walls or fill joints be- tween adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound that comprises a dust-reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust-reduction additive also synergisti- cally imparts water resistance and adhesion to the wall repair compounds to which it is added. More specifically, in one embodiment, the dust-reduction additive is an emulsion comprising colloidally-protected, wax-based microstructures comprising paraffin that is chemically encapsu- lated by polyvinyl alcohol. |
