发明名称 LIGHT-EMITTING ELEMENT PACKAGE AND LIGHT-EMITTING ELEMENT MODULE COMPRISING SAME
摘要 Provided is a light-emitting element package, one embodiment comprising: a substrate; a light-emitting element disposed on the substrate; and a molded part surrounding the side surfaces and the top surface of the light-emitting element and having patterns on a surface from which the light incident thereto from the light-emitting element is output, wherein a part of the patterns correspond to a first area corresponding to the light-emitting element, and to a second area around the first area and are arranged at an angular range of 120 to 130 degrees on the surface of the molded part.
申请公布号 WO2017003095(A1) 申请公布日期 2017.01.05
申请号 WO2016KR05381 申请日期 2016.05.20
申请人 LG INNOTEK CO., LTD. 发明人 KIM, Ki Hyun
分类号 H01L33/52;H01L33/50;H01L33/58 主分类号 H01L33/52
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