CUTTING ASSIST DEVICE FOR SILICON MATERIAL, CUTTING METHOD, AND CUTTING SYSTEM

摘要

A cutting assist device for silicon materials which, when cutting a silicon material, supplies an inorganic-alkali electrolyzed water containing fine bubbles and having a pH of 10 or higher as a cutting fluid to the part of the silicon material which is being cut; and a system for cutting silicon materials which is equipped with a cutter for cutting silicon materials and with a cutting assist device for supplying an inorganic-alkali electrolyzed water containing fine bubbles and having a pH of 10 or higher as a cutting fluid to the part of the silicon material which is being cut.