| 发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
A sample semiconductor device is manufactured and the curvature of the sample is measured. An area is set to be removed from an encapsulation resin layer on the basis of the measurement value. After forming the encapsulation resin layer during the process of manufacturing the semiconductor device, the removal area is removed. |
| 申请公布号 |
US2017005020(A1) |
申请公布日期 |
2017.01.05 |
| 申请号 |
US201615206653 |
申请日期 |
2016.07.11 |
| 申请人 |
PS5 LUXCO S.A.R.L |
发明人 |
Usami Sensho |
| 分类号 |
H01L21/66;H01L25/00;H01L23/00;H01L25/065;H01L21/56;H01L23/31 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a semiconductor device, comprising:
manufacturing a sample semiconductor device; taking a measurement value relating to curvature of the sample; determining a removal region having a region for removal from a sealing resin layer covering one surface of the semiconductor device positioned on the opposite side of a substrate when the semiconductor device is mounted on said substrate in accordance with the measurement value; forming the sealing resin layer; and removing the removal region. |
| 地址 |
LUXEMBOURG LU |
