Modular Dense Energy Ultra Cell and Process for Fabrication

摘要

A hybrid ultra-capacitor and Dense Energy Ultra Cell (DEUC) energy storage device and methods of production are described. An example method uses print processes to deposit energy storage layers that are interleaved in between electrodes to enable rapid charge and dense energy storage in a scalable Element with efficient fabrication methods to support a wide variety of applications.

主权项

1. A Dense Energy Ultra Cell (DEUC) energy storage device comprised of one or more DEUC Elements where the DEUC Elements are comprised of:
a. A plurality of dielectric particles and or core shell dielectric particles form layers of less than 10 microns thick, with an internal resistivity of greater than 100 mega-ohms, that are interleaved in between electrode layers to form a multi-layer thin film, and b. where the layers of the multi-layer thin films are deposited via a spray and or print process, and c. where two or more electrode layers are deposited as an electrically conducting printable solution comprised of conducting Nano particles, a binder and a solvent, and d. where the electrode layers are offset left and right in alternating layers to form the left and right inner electrode arrays, and e. where the one or more dielectric layers are deposited as a printable solution comprised of calcium copper titanate oxide (CCTO) particles and or a modified stoichiometric formula of calcium copper titanate oxide (CCTO-X), a binder and solvent, and f. where the CCTO and or CCTO-X particles have an electrically insulating material such as alumina added to the mixture as a shell coating of the CCTO and or CCTO-X particles and or separate particles, and g. where CCTO-X is comprised of modified calcium copper titanate oxide (CaCu3Ti402), also known as (CCTO-X), with variations in the amounts of copper and or calcium and or titanate content to increase the resistivity and permittivity when sintered, and h. where the energy storage layer and electrode layers have similar shrinkage and growth affects when subjected to heat, and i. where one or more unified multilayer thin film(s) are combined and heat treated together at 500 degrees Celsius to burn off the binders and other chemicals present, and j. where the one or more unified multilayer thin film(s) are sintered at up to 1,200 Celsius, combining all of the layers into a multilayer ceramic DEUC Element, and k. where the CCTO and or CCTO-X particles (grains) form in internal layer barrier capacitor (IBLC) when sintered, and l. where the electrically insulating shell and or particles increases resistivity across the dielectric energy storage layer and reduces charge dissipation, and m. where external electrodes are applied to the left and right inner electrode arrays.