APPARATUS AND METHOD FOR CONTACTLESS TRANSFER AND SOLDERING OF CHIPS USING A FLASH LAMP

摘要

A chip carrier (8) is provided between a flash lamp (5) and a substrate (3). The chip (la) is attached to the chip carrier (8) on a side of the chip carrier (8) facing the substrate (3). A solder material (2) is disposed between the chip (la) and the substrate (3). The flash lamp (5) generates a light pulse (6) for heating the chip (la). The heating of the chip (la) causes the chip (la) to be released from the chip carrier (8) towards the substrate (3) to transfer contactlessly towards the substrate (3). The solder material (2) is at least partially melted by contact with the heated chip (la) for attaching the chip (la) to the substrate (3). A masking device (7) may be disposed between the flash lamp (5) and the chip (la), comprising a masking pattern (7a) configured to selectively pass light (6a) of the light pulse (6) to the chip (la). A plurality of chips having different heating properties (e.g. caused by different dimensions (surface area and/or thickness), heat capacity, absorptivity, conductivity, number and/or size of solder bonds) may be simultaneously transferred from the chip carrier (8) to the substrate (3) and soldered to the substrate (3), using a masking device (7) causing different light intensities in different areas of the light pulse (6) passing the masking device (7) thereby heating the chips with different light intensities for at least partially compensating the different heating properties to reduce a spread in temperature between the chips as a result of the heating by the light pulse (6).