| 发明名称 |
CHIP PACKAGE |
| 摘要 |
An embedded die package and method of manufacture, the die package comprising a die having I/O contact pads in a passivation layer wherein the die contact pads are coupled to a first side of a feature layer by an adhesion/barrier layer, and a layer of pillars extends from a second side of the feature layer, the die, feature layer and the layer of pillars being encapsulated by a dielectric material and wherein the feature layer comprises routing lines that are individually drawn by laser exposure of photoresist under guidance of an optical imaging system for good alignment with both the I/O contact pads of the die and with the subsequently to be deposited pillars that are positioned with respect to the package edges. |
| 申请公布号 |
US2017005058(A1) |
申请公布日期 |
2017.01.05 |
| 申请号 |
US201514836111 |
申请日期 |
2015.08.26 |
| 申请人 |
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. |
发明人 |
Hurwitz Dror;Huang Alex |
| 分类号 |
H01L23/00;H01L23/29;H01L21/683;H01L21/78;H01L21/027;H01L23/31;H01L23/498 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An embedded die package comprising a die having I/O contact pads in a passivation layer, the die contact pads being coupled to a first side of a feature layer by an adhesion/barrier layer, and a layer of pillars extending from a second side of the feature layer, the die, feature layer and the layer of pillars being encapsulated by a dielectric material wherein the feature layer comprises routing lines that are individually drawn for good alignment with the I/O contact pads of the die and with pillars. |
| 地址 |
Zhuhai CN |
