WIRING BOARD, THERMAL HEAD, AND METHOD FOR PRODUCING WIRING BOARD

摘要

A wiring board is provided with an insulating substrate and a first conductive layer and a second conductive layer that are layered on the substrate. The second conductive layer has a lower ionization tendency than the first conductive layer. A stepped section or an alloy section in which the second conductive layer protrudes laterally beyond the first conductive layer is provided to the outer periphery of the boundary between the first conductive layer and the second conductive layer by performing etching processing one time on the first conductive layer and the second conductive layer.