| 摘要 |
The present invention provides a film for manufacturing semiconductor parts, a method of manufacturing semiconductor parts, semiconductor parts, and an evaluation method in which an evaluation step accompanied with a temperature change, a dicing step, and a pickup step can be commonly performed. In other words, this film 1 for manufacturing semiconductor parts is provided with: a substrate layer 11; and an adhesive layer 12 provided on one surface side of the substrate layer, wherein the ratio RE(=E'(160)/E'(-40)) of the elastic modulus of E'(160) at 160°C to the elastic modulus of E'(-40) at -40°C for the substrate layer 11 satisfies RE≥0.01, and E'(-40) is equal to or greater than 10 MPa and smaller than 1000 MPa. The present method is provided with: a step for adhering the adhesive layer 12 on the rear surface of a semiconductor wafer with circuits formed thereon; a step for dicing the semiconductor wafer to obtain semiconductor parts; and a pickup step for separating the semiconductor parts from the adhesive layer 12, said method being further provided with a step for evaluating the semiconductor wafer or the semiconductor parts before the pickup step. |
