| 摘要 |
A packaging structure and packaging method for an OLED thin film, and a display device. The packaging structure comprises: a base substrate (110); an OLED device (120) located on the base substrate (110); and a first passivation layer (130) covering the OLED device (120). The first passivation layer (130) comprises at least one thinning area (131) on the surface thereof away from the OLED device (120), the thickness of the thinning area (131) being less than that of the first passivation layer (130). By means of the method, the bending performance of the packaged part of the flexible OLED device (120) can be improved. |
