| 发明名称 |
Integrate Rinse Module in Hybrid Bonding Platform |
| 摘要 |
A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component. |
| 申请公布号 |
US2017004964(A1) |
申请公布日期 |
2017.01.05 |
| 申请号 |
US201615269346 |
申请日期 |
2016.09.19 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Huang Xin-Hua;Liu Ping-Yin;Lin Hung-Hua;Kuang Hsun-Chung;Hsieh Yuan-Chih;Chao Lan-Lin;Tsai Chia-Shiung;Chen Xiaomeng |
| 分类号 |
H01L21/02;B23K1/20;H01L23/00;B23K1/00 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
using an apparatus to form a package component, the apparatus comprising:
an integrated cleaning station comprising:
a chamber;a storage outside of the chamber, wherein the storage is configured to store liquid;a nozzle in the chamber and connected to the storage; anda retractable wafer support in the chamber, wherein the retractable wafer support is configured to rotate the package component, and spin the package component at different levels. |
| 地址 |
Hsin-Chu TW |
