| 发明名称 |
BINDING DEVICE INCLUDING SENSOR MODULE, SECURITY PROCESSING METHOD USING THE SAME, AND ELECTRONIC DEVICE INCLUDING BINDING DEVICE |
| 摘要 |
An electronic device is provided. The electronic device includes a body and a binding device, the binding device extending from the body to surround a mounting target. The binding device includes a sensor module, and the sensor module includes at least one first sensor disposed on a first surface of the binding device to sense a portion of the user's body to collect sensing information. |
| 申请公布号 |
US2017004298(A1) |
申请公布日期 |
2017.01.05 |
| 申请号 |
US201615202278 |
申请日期 |
2016.07.05 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JUN WON;KIM DONG HUN;HA JIN SOO;KIM DA HWUN;KIM TAE WOO;HWANG JIN SANG |
| 分类号 |
G06F21/32;G06F21/62 |
主分类号 |
G06F21/32 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
a body; and a binding device extending from the body to surround a mounting target, wherein the binding device includes a sensor module, and wherein the sensor module includes at least one first sensor disposed on a first surface of the binding device to sense a portion of the user's body to collect sensing information. |
| 地址 |
GYEONGGI-DO KR |
