| 发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A printed circuit board and a method of manufacturing the same are provided. A printed circuit board having conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core is provided. The printed circuit board includes a first insulating material disposed on a first surface and a second surface of the glass core. and a second insulating material disposed on the first insulating material. The first insulating material surrounds a first portion of a side surface of the glass core and the second insulating material surrounds a second portion of the side surface of the glass core, the second portion being a portion of the glass core not surrounded by the first insulating material. |
| 申请公布号 |
US2017006700(A1) |
申请公布日期 |
2017.01.05 |
| 申请号 |
US201615157627 |
申请日期 |
2016.05.18 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Byung-Moon;PARK Ho-Sik;LEE Dong-Keun;LEE Sung-Jun |
| 分类号 |
H05K1/02;H05K3/10;H05K3/00;H05K3/40;H05K1/03;H05K3/46 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board having conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core, the printed circuit board comprising:
a first insulating material disposed on a first surface and a second surface of the glass core; and a second insulating material disposed on the first insulating material, wherein the first insulating material surrounds a first portion of a side surface of the glass core and the second insulating material surrounds a second portion of the side surface of the glass core, the second portion being a portion of the glass core not surrounded by the first insulating material. |
| 地址 |
Suwon-Si KR |
