METHOD AND APPARATUS FOR TREATING SUBSTRATE

摘要

Disclosed is a method for treating a substrate, the method including a pre-wetting operation of discharging pure water onto an upper surface of the substrate, and a treatment operation of treating the substrate by supplying a treatment liquid onto the upper substrate, after the pre-wetting operation, wherein the method further includes a static electricity removing operation of removing static electricity by discharging a static electricity removing liquid onto a lower surface of the substrate, before the treatment operation.

主权项

1. A method for treating a substrate, the method comprising:
a pre-wetting operation of discharging pure water onto an upper surface of the substrate; and a treatment operation of treating the substrate by supplying a treatment liquid onto the upper substrate, after the pre-wetting operation, wherein the method further comprises a static electricity removing operation of removing static electricity by discharging a static electricity removing liquid onto a lower surface of the substrate, before the treatment operation.