ADHESIVE COMPOSITION, IN PARTICULAR FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT

摘要

The invention relates to an adhesive composition, preferably pressure-sensitive adhesive composition, comprising a) at least one (co)polymer containing at least isobutylene and/or butylene as comonomer type and, optionally but preferably, at least one comonomer type that - when considered in hypothetical homopolymer form - has a softening point above 40°C, b) at least one type of at least partially hydrogenated adhesive resin, c) at least one type of reactive resin based on a cyclic ether with a softening point below 40°C, preferably below 20°C, d) at least one type of latently reactive thermally activatable initiator for initiating cationic curing.