发明名称 ACTIVE HEAT FLOW CONTROL WITH THERMOELECTRIC LAYERS
摘要 Methods and apparatuses for controlling heat flow in a mobile system. The method includes determining a temperature value for each of at least one temperature sensors. The method determines a delta value of a current temperature threshold at each of the plurality of locations. The method maps each delta value to a thermal module. The method calculates a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model. The method transmits the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.
申请公布号 EP3111295(A1) 申请公布日期 2017.01.04
申请号 EP20150713037 申请日期 2015.02.13
申请人 Qualcomm Incorporated 发明人 PARK, Hee Jun;CHIRIAC, Victor Adrian;ANDERSON, Jon James;TU, Alex Kuang-Hsuan
分类号 G06F1/20 主分类号 G06F1/20
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