发明名称 |
ACTIVE HEAT FLOW CONTROL WITH THERMOELECTRIC LAYERS |
摘要 |
Methods and apparatuses for controlling heat flow in a mobile system. The method includes determining a temperature value for each of at least one temperature sensors. The method determines a delta value of a current temperature threshold at each of the plurality of locations. The method maps each delta value to a thermal module. The method calculates a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model. The method transmits the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor. |
申请公布号 |
EP3111295(A1) |
申请公布日期 |
2017.01.04 |
申请号 |
EP20150713037 |
申请日期 |
2015.02.13 |
申请人 |
Qualcomm Incorporated |
发明人 |
PARK, Hee Jun;CHIRIAC, Victor Adrian;ANDERSON, Jon James;TU, Alex Kuang-Hsuan |
分类号 |
G06F1/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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