发明名称 |
ADDITIONAL FUNCTIONALITY SINGLE LAMMINATION STACKED VIA WITH PLATED THROUGH HOLES FOR MULTILAYER PRINTED CIRCUIT BOARDS |
摘要 |
Methods of manufacturing at least a portion of a printed circuit board. The circuit board is formed to include a plurality of sub-assemblies, each of the sub-assemblies including a plurality of circuit layers and having at least one countersink and at least one hole, the countersink having a first diameter and a first depth from a first side of at least one of the sub-assemblies and into the at least one sub-assembly, the hole having a second diameter smaller than the first diameter and a second depth longer than the first depth from the first side of the at least one sub-assembly and into the at least one sub-assembly at the countersink; a metal metalized within the hole and the countersink; a lamination adhesive interposed between one and a corresponding one of the sub-assemblies and having at least one via formed therethrough; and a counter paste filled within the via. |
申请公布号 |
EP2327282(B1) |
申请公布日期 |
2017.01.04 |
申请号 |
EP20090807322 |
申请日期 |
2009.08.13 |
申请人 |
VIASYSTEMS TECHNOLOGIES CORP., L.L.C. |
发明人 |
KUMAR, Raj;DREYER, Monte;TAYLOR, Michael, J.;ZEPEDA, Ruben |
分类号 |
H05K1/11;H05K1/03;H05K3/38;H05K3/40;H05K3/42;H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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