| 摘要 |
The present disclosure provides methods, device, and system for wafer processing. The wafer processing apparatus uses lid dispenser to disperse at least one reagent to the surface of the wafer. Further, the wafer is positioned on top of a rotatable vacuum chuck configured to spread at least one reagent over the surface of the wafer via a centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent. Further, when dispensing the at least one reagent, a separation gap between the lid dispenser and the wafer is at a predetermined distance, for example, from 50 µm to 2 mm. |
