| 摘要 |
A package 11 for a semiconductor device or circuit comprises a semiconductor switch module 12 having a metallic base 10 on an exterior side and metallic pads 57 on an opposite side, a sealed metallic enclosure 61 holds the semiconductor switch module, the metallic enclosure has a set of dielectric regions 65 with embedded or pass-through electrical terminals 50 that are electrically insulated or isolated from the sealed metallic enclosure, the electrical terminals are electrically connected to the metallic pads; a housing is adapted for housing the semiconductor switch module within the metallic enclosure, the housing comprises chamber for holding or circulating a coolant overlying the metallic base. The metallic base may comprise grooves or channels. A lid 38 (Figure 1) and seal framework may be secured to the housing. A fluid coolant channel 26 (Figure 1) may be included in the chamber. The metallic enclosure may be hermetically sealed via a welding process. |
