| 摘要 |
A method of reducing the thickness of an electronic circuit comprising a printed circuit and electronic components, comprising the following steps: mounting electronic components in die form on the printed circuit, putting an insulating layerinto place on the electronic components, and putting a conductive layer on the insulating layer. An electronic circuit obtained by such a method. A thin plastics card of credit card format including such an electronic circuit. A bank card including such an electronic circuit. |
