| 摘要 |
The present invention relates to a unit ultrasonic wave probe, an ultrasonic wave probe module, and an ultrasonic wave probe device. The unit ultrasonic probe according to the present invention includes: a rear block part; a flexible substrate part arranged on the top of the rear block part; and a piezoelectric wafer arranged on the top of and electrically connected with the flexible substrate part, the wafer being formed to have a smaller size than the rear block part, so that even if increasing the number of piezoelectric wafers transversely, the number of channels is increased by depositing the unit ultrasonic wave probe including the piezoelectric wafer, thus preventing the cost from geometrically increasing because of the structure of the flexible substrate becoming complex. |
