High-density rack unit systems and methods

摘要

High-density rack unit systems and methods are described for telecommunication and data communication systems that utilize novel airflow mechanisms thereby enabling modularity and high-density in small-form factor units. The high-density rack unit systems and methods offer novel airflow mechanisms via right-angle backplane connectors to enable more airflow in a rack unit as well as novel field replaceable fans in these high-density rack units. Further, the high-density rack unit systems and methods include a baffle structure to keep power-supply-related airflow separate from the airflow over other components in the 1U or 2U rack unit. In this manner, the high-density rack unit systems and methods enable system vendors and network operators to realize significant density improvements.

主权项

1. A rack unit system, comprising:
a physical housing comprising a front side, a back side, a left side, and a right side, wherein the left side and the right side are configured to connect to a rack, wherein the physical housing comprising 1RU (Rack Unit) or 2RU of height; bottom-plane connections located at or near the back side, wherein the bottom-plane connections interface to right-angle connections on associated bottom-plane circuit boards connecting the associated bottom-plane circuit boards to one another and wherein the associated bottom-plane circuit boards are in a horizontal plane inside the physical housing; and a first plurality of openings in the back side located in substantially unobstructed portions of the back side thereby enabling airflow through the physical housing; a power supply located internal to the physical housing, wherein the power supply is located in the horizontal plane with the associated bottom-plane circuit boards; a second plurality of openings located on either the left side or the right side for providing enabling airflow through the physical housing over the power supply; and a baffle blocking airflow from the front side from the power supply such that airflow from the power supply is disjoint from airflow associated with the associated bottom-plane circuit boards, wherein the baffle is located from a top side to a bottom side of the physical housing.