发明名称 Laminated busbar for power converter and the converter thereof
摘要 The present application discloses a laminated busbar arrangement for use in a three-level power converter and a power converter. The laminated busbar arrangement comprises a first layer of busbar comprising a neutral-point sub busbar configured to make electrical connections between respective components in the three-level power converter and a neutral-point potential; a second layer of busbar comprising a plurality of sub busbars configured make electrical connections between the respective components in the three-level power converter and a positive direct current (DC) input, a negative DC input and an alternating current (AC) input/output in the three-level power converter, and between respective semiconductor switching components. The present application may effectively reduce stray inductance.
申请公布号 US9538680(B2) 申请公布日期 2017.01.03
申请号 US201313839032 申请日期 2013.03.15
申请人 DELTA ELECTRONICS, INC. 发明人 Li Yan;Gan Hongjian;Wen Senlin;Ying Jianping
分类号 H05K7/02;H02M7/00;H02M7/487;H02M1/34 主分类号 H05K7/02
代理机构 Eaton & Van Winkle 代理人 Ren Yunling;Eaton & Van Winkle
主权项 1. A laminated busbar for use in a NPC three-level power converter, comprising: a first layer of busbar comprising a neutral-point sub busbar, configured to make electrical connections between respective components in the NPC three-level power converter and a neutral-point potential; and a second layer of busbar comprising a plurality of sub busbars, configured to make electrical connections between the respective components in the NPC three-level power converter and a positive DC input, a negative DC input and an AC input/output in the NPC three-level power converter and electrical connections between the respective components, wherein, the NPC three-level power converter comprises: a first semiconductor module comprising a first semiconductor component located at an upper arm of the NPC three-level power converter and a first freewheeling diode connected in parallel with the first semiconductor component; a second semiconductor module comprising a second semiconductor component located at an upper arm of the NPC three-level power converter and a second freewheeling diode connected in parallel with the second semiconductor component; a third semiconductor module comprising a third semiconductor component located at a lower arm of the NPC three-level power converter and a third freewheeling diode connected in parallel with the third semiconductor component; a fourth semiconductor module comprising a fourth semiconductor component located at a lower arm of the NPC three-level power converter and a fourth freewheeling diode connected in parallel with the fourth semiconductor component; a fifth semiconductor module comprising a first clamping diode, a terminal of which is connected between the first semiconductor component module and the second semiconductor module, and another terminal of which is connected to the neutral-point potential of the NPC three-level power converter; and a sixth semiconductor module comprising a second clamping diode, a terminal of which is connected between the third semiconductor module and the fourth semiconductor module, and another terminal of which is connected to the neutral-point potential of the NPC three-level power converter; wherein the second layer of busbar comprises: a first sub busbar configured to make electrical connection between the first semiconductor module and the positive DC input;a second sub busbar configured to make electrical connections between the first semiconductor module, the second semiconductor module and the fifth semiconductor module;a third sub busbar configured to make electrical connections between the third semiconductor module, the fourth semiconductor module and the fifth semiconductor module;a fourth sub busbar configured to make electrical connection between the fourth semiconductor module and the negative DC input; anda fifth sub busbar configured to make electrical connections between the second semiconductor module, the third semiconductor module and the AC input/output; and wherein the neutral-point sub busbar is respectively connected to another terminal of the first clamping diode and another terminal of the second clamping diode.
地址 Taoyuan TW