Method of manufacturing module

摘要

When forming a module 100 having a configuration in which a column-shaped connection terminal 11, which forms an interlayer connection conductor, and an electronic component 102 are mounted on a wiring substrate 101 and sealed with a resin, the column-shaped connection terminal 11 which has a substantially T-shaped cross section and in which a first end portion has a larger diameter than a second end portion is prepared (the preparation step), an electronic component 102 is mounted on one main surface of the wiring substrate 101 and the connection terminal 11 is mounted on the one main surface in such a manner that the second end portion of the connection terminal 11 having a smaller diameter is connected to the wiring substrate 101 (the mounting step), and the electronic component 102 and the connection terminal 11 are sealed with a resin layer 103 (the sealing step).

主权项

1. A method of manufacturing a module comprising a wiring substrate, one or more column-shaped connection terminals forming an interlayer connection conductor, and one or more first electronic components, the column-shaped connection terminals and the first electronic components being mounted on the wiring substrate and sealed with a resin, the method comprising:
a providing step of providing one or more column-shaped connection terminals each having a substantially T-shaped cross section, a first end portion of each of the connection terminals having a larger diameter than a second end portion of each of the connection terminals; a first mounting step of mounting one or more first electronic components on one main surface of the wiring substrate, and mounting the connection terminals on the one main surface of the wiring substrate in such a manner that the second end portion of each of the connection terminals having a smaller diameter is connected to the wiring substrate; and a first sealing step of sealing the first electronic components and the connection terminals with a resin layer.