Multilayer wiring substrate and module including same

摘要

A multilayer wiring substrate includes a multilayer body in which a plurality of insulating layers is stacked and to which an electronic component is mounted, a plurality of connection terminals disposed on one principal surface of the multilayer body for connection to the electronic component, and a plurality of rear electrodes disposed on the other principal surface of the multilayer body, wherein the connection terminals are each arranged in overlapped relation to one of the rear electrodes when looked at in a plan view of the multilayer wiring substrate.

主权项

1. A multilayer wiring substrate comprising:
a multilayer body in which a plurality of insulating layers is stacked and to which an electronic component is mounted; a plurality of connection terminals disposed on one principal surface of the multilayer body for connection to the electronic component; a plurality of rear electrodes disposed on another principal surface of the multilayer body; and an in-plane conductor disposed inside the multilayer body on at least one of the insulating layers; wherein the connection terminals are each arranged in overlapped relation to one of the rear electrodes when looked at in a plan view of the multilayer wiring substrate; and a thickness of each of the rear electrodes is greater than a thickness of the in-plane conductor.