Flip chip bonder and flip chip bonding method

摘要

Provided is a flip chip bonder including: a pickup flipping collet configured to flip a chip; and a bonding tool configured to receive the chip flipped with the pickup flipping collet from the pickup flipping collet and to bond the received chip to a circuit board. The pickup flipping collet includes a cooling channel through which cooling air flows to cool the pickup flipping collet. Thus, bonding time can be reduced without lowering bonding quality.

主权项

1. A flip chip bonder comprising:
a flip mechanism configured to flip a chip; bonding tool configured to receive the chip flipped by the flip mechanism from the flip mechanism and to bond the received chip to a substrate; and a cooling mechanism configured to cool the flip mechanism; wherein the flip mechanism includes a holding member for holding the flipped chip, and the cooling mechanism cools the holding member down to a predetermined temperature before the bonding tool receives the chip.