发明名称 High-frequency signal transmission line and electronic device
摘要 A high-frequency signal transmission line includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided at the dielectric element assembly, and a first ground conductor provided on a first side in a direction of lamination relative to the signal line and including a plurality of openings arranged along the signal line. The dielectric layer positioned at an end of the first side in the direction of lamination includes an undulating portion provided on a first principal surface located on the first side in the direction of lamination, such that the undulating portion overlaps with the openings when viewed in a plan view in the direction of lamination.
申请公布号 US9538638(B2) 申请公布日期 2017.01.03
申请号 US201414520504 申请日期 2014.10.22
申请人 Murata Manufacturing Co., Ltd. 发明人 Yosui Kuniaki;Kato Noboru
分类号 H01P3/08;H05K1/02;H05K1/11;H05K1/14 主分类号 H01P3/08
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A high-frequency signal transmission line, comprising: a dielectric element assembly including a plurality of dielectric layers laminated on each other in a lamination direction, the plurality of dielectric layers having substantially the same dielectric constant; a linear signal line provided at the dielectric element assembly; and a first ground conductor provided on a first side in the lamination direction relative to the signal line and including a plurality of openings arranged along the signal line; wherein one of the plurality of dielectric layers that is positioned at an end of the first side in the lamination direction includes an undulating portion provided on a first surface located on the first side in the lamination direction, such that the undulating portion overlaps with the openings when viewed in a plan view in the lamination direction; the undulating portion is defined by grooves provided in the dielectric layer at the end of the first side in the lamination direction, the grooves extending along the signal line in the first surface; the first ground conductor has a ladder-shaped configuration with bridge portions provided between the openings being adjacent to one another; and the grooves overlap with the bridge portions when viewed in a plan view in the lamination direction.
地址 Kyoto JP