发明名称 |
Method of manufacturing semiconductor light emitting device, and semiconductor light emitting device |
摘要 |
When an uneven pattern is formed on a light extraction surface composed of a semiconductor crystal by wet-etching using an alkaline solution, a plurality of convex portions cannot be formed in a desired arrangement. A method of manufacturing a semiconductor light emitting device includes a light extraction surface composed of a semiconductor crystal, wherein when the uneven pattern is formed by a plurality of convex portions on the light extraction surface, first, a plurality of impressions are formed on the light extraction surface of a semiconductor layer composed of a semiconductor crystal using a processing substrate, and next, by applying wet-etching to the light extraction surface using an alkaline solution, to thereby form convex portions with a portion where each impression is formed as a top portion, and a plurality of facets of the semiconductor crystal as a side face thereof. |
申请公布号 |
US9537066(B2) |
申请公布日期 |
2017.01.03 |
申请号 |
US201414909359 |
申请日期 |
2014.07.30 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
Kadowaki Yoshitaka |
分类号 |
H01L33/00;H01L33/58;H01L33/22;H01L33/20 |
主分类号 |
H01L33/00 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. A method of manufacturing a semiconductor light emitting device having a light extraction surface and composed of a semiconductor crystal, comprising:
forming an uneven pattern on the light extraction surface, the formation of the uneven pattern further comprising: a first step of forming a plurality of pressed marks on the light extraction surface; and a second step of forming a plurality of convex portions with portions where the pressed marks are formed as top portions and a plurality of facets of the semiconductor crystal as a side face thereof, by applying etching to the light extraction surface on which the plurality of pressed marks are formed. |
地址 |
Tokyo JP |