发明名称 Positive relief forming of polycrystalline diamond structures and resulting cutting tools
摘要 Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.
申请公布号 US9533398(B2) 申请公布日期 2017.01.03
申请号 US201414463587 申请日期 2014.08.19
申请人 US SYNTHETIC CORPORATION 发明人 Miess David P.
分类号 B24D3/00;B24D3/02;B24D11/00;B24D18/00;C09K3/14 主分类号 B24D3/00
代理机构 Dorsey & Whitney LLP 代理人 Dorsey & Whitney LLP
主权项 1. A method of making a polycrystalline diamond (“PCD”) structure, the method comprising: providing a substrate having a surface; positioning at least one diamond material flute volume including at least one diamond material tube including diamond particles, the at least one diamond material tube in contact with a portion of the surface of the substrate; and subjecting the substrate and the at least one diamond material flute volume to a high-pressure/high-temperature (“HPHT”) process effective to sinter the diamond particles to form a PCD flute volume and bond the PCD flute volume.
地址 Orem UT US