发明名称 |
Positive relief forming of polycrystalline diamond structures and resulting cutting tools |
摘要 |
Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate. |
申请公布号 |
US9533398(B2) |
申请公布日期 |
2017.01.03 |
申请号 |
US201414463587 |
申请日期 |
2014.08.19 |
申请人 |
US SYNTHETIC CORPORATION |
发明人 |
Miess David P. |
分类号 |
B24D3/00;B24D3/02;B24D11/00;B24D18/00;C09K3/14 |
主分类号 |
B24D3/00 |
代理机构 |
Dorsey & Whitney LLP |
代理人 |
Dorsey & Whitney LLP |
主权项 |
1. A method of making a polycrystalline diamond (“PCD”) structure, the method comprising:
providing a substrate having a surface; positioning at least one diamond material flute volume including at least one diamond material tube including diamond particles, the at least one diamond material tube in contact with a portion of the surface of the substrate; and subjecting the substrate and the at least one diamond material flute volume to a high-pressure/high-temperature (“HPHT”) process effective to sinter the diamond particles to form a PCD flute volume and bond the PCD flute volume. |
地址 |
Orem UT US |