发明名称 |
Bimodal cooling in modular server system |
摘要 |
A server system includes a plurality of stacked modular computing structures. Each modular computing structure includes a circuit board comprising a computing resource, an air-fluid heat exchange structure comprising a first set of pipe segments, and a cold plate structure attached to a second set of pipe segments of the modular computing structure. The first set of pipe segments of each modular computing structure interfaces with the first set of pipe segments of at least one adjacent modular computing structure to form a corresponding section of a first fluid circulation loop. The second set of pipe segments of each modular computing structure interfaces with the second set of pipe segments of at least one adjacent modular computing structure to form a corresponding section of a second fluid circulation loop. |
申请公布号 |
US9538688(B2) |
申请公布日期 |
2017.01.03 |
申请号 |
US201514657316 |
申请日期 |
2015.03.13 |
申请人 |
Advanced Micro Devices, Inc. |
发明人 |
Fricker Jean-Philippe |
分类号 |
H05K5/00;H05K7/20;H05K7/14 |
主分类号 |
H05K5/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A server system comprising:
a plurality of modular computing structures stacked in a first orientation, each modular computing structure comprising:
a circuit board comprising a computing resource;an air-fluid heat exchange structure comprising a first set of pipe segments; anda cold plate structure attached to a second set of pipe segments of the modular computing structure; and wherein the first set of pipe segments of each modular computing structure interfaces with the first set of pipe segments of at least one adjacent modular computing structure to form a corresponding section of a first fluid circulation loop; and wherein the second set of pipe segments of each modular computing structure interfaces with the second set of pipe segments of at least one adjacent modular computing structure to form a corresponding section of a second fluid circulation loop. |
地址 |
Sunnyvale CA US |