| 主权项 |
1. An organic light emitting diode (OLED) package structure, comprising:
an OLED substrate including an OLED component, wherein the OLED component is disposed on a surface of the OLED substrate; and a package substrate including an active metal film for absorbing oxygen in the package structure, wherein the active metal film is disposed on a surface of the package substrate, and at least one irregular protrusion is formed on a surface of the active metal film, and the active metal film is a copper film; wherein a sealed chamber is formed by using a sealant to bond the OLED substrate and the package substrate, and the OLED component and the active metal film are positioned in the sealed chamber; wherein the active metal film comprises at least one active metal block, and at least one irregular protrusion is formed on a surface of the active metal block; and a desiccant layer is disposed on the active metal film for absorbing vapor in the package structure, the desiccant layer is made from a spherical desiccant, and the diameter of a particle of the spherical desiccant is between 0.04 to 0.07 mm. |
