Transmission line implementation in wafer-level packaging

摘要

In an integrated circuit package that houses radio-frequency (RF) circuits or components using wafer-level packaging (WLP), an RF-signal transmission structure includes a signal-carrying conductive line positioned between grounded conductive lines to avoid undesirable coupling between the signal-carrying conductive line and other RF circuits or components in the same package.

主权项

1. A device, comprising:
a ground; a first plurality of conductors coupled to the ground; a second plurality of conductors coupled to the ground; a first conductive line coupled to the first plurality of conductors; a second conductive line coupled to the second plurality of conductors, the second conductive line substantially in parallel with the first conductive line; a third conductive line positioned between and substantially in parallel with the first conductive line and the second conductive line, the third conductive line comprising a radio-frequency (RF) signal input and an RF signal output, a first plurality of conductive caps coupled between the first plurality of conductors and the first conductive line; and a second plurality of conductive caps coupled between the second plurality of conductors and the second conductive line.