Image pickup apparatus and image pickup apparatus manufacturing method

摘要

An image pickup apparatus includes: an image pickup device disposed in a first principal surface of a silicon substrate, the image pickup device sensing infrared light; an electrode pad disposed on the first principal surface; a front-face wiring connecting the image pickup device and the electrode pad; an external connection terminal disposed on a second principal surface of the silicon substrate; a back-face wiring connecting the electrode pad and the external connection terminal via a substrate through-hole extending from the second principal surface side through the silicon substrate to a back face of the electrode pad; and a light blocking layer disposed on the second principal surface, the light blocking layer covering a trench portion surrounding the image pickup device and a region surrounded by the trench portion.

主权项

1. An image pickup apparatus comprising:
a semiconductor substrate including a first principal surface and a second principal surface facing the first principal surface, the semiconductor substrate transmitting infrared light; an image pickup device disposed in the first principal surface, the image pickup device including an image pickup section that senses visible light and the infrared light, and a peripheral circuit portion that is disposed in a periphery of the image pickup section; an electrode pad disposed on the first principal surface; a front-face wiring disposed on the first principal surface, the front-face wiring connecting the image pickup device and the electrode pad; an external connection terminal disposed on the second principal surface; a back-face wiring disposed on the second principal surface, the back-face wiring connecting the electrode pad and the external connection terminal via a substrate through-hole extending from the second principal surface through the semiconductor substrate to a back face of the electrode pad; a trench portion formed in a frame-like shape as to surround a region of the second principal surface corresponding to the image pickup device disposed in the first principal surface; and a light blocking layer disposed on the second principal surface so as to cover an internal surface of the trench portion and the region surrounded by the trench portion; wherein the light blocking layer covers an entirety of the region surrounded by the trench portion and completely covers an inner side of the trench portion.