发明名称 Substrate liquid processing apparatus
摘要 A substrate liquid processing apparatus includes a cup 50 configured to receive a processing liquid supplied onto a substrate. The cup includes a ring-shaped first exhaust space 530 in contact with a top opening 50A, and a ring-shaped second exhaust space 540 which is in contact with an exhaust port 52 and is disposed adjacent to the first exhaust space, and the first exhaust space and the second exhaust space communicate with each other intermittently or continuously along an entire circumference thereof. Further, the cup has an inner wall that confines an inner periphery of the second exhaust space, and the inner wall includes a first wall portion 581 serving as an upper part of the inner wall, and a second wall portion which serves as a lower part of the inner wall and is located at an inner position than the first wall portion in a radial direction.
申请公布号 US9536761(B2) 申请公布日期 2017.01.03
申请号 US201514840237 申请日期 2015.08.31
申请人 TOKYO ELECTRON LIMITED 发明人 Amano Yoshifumi;Ito Yuki;Okamoto Eiichiro
分类号 H01L21/67 主分类号 H01L21/67
代理机构 Pearne & Gordon LLP 代理人 Pearne & Gordon LLP
主权项 1. A substrate liquid processing apparatus, comprising: a holding unit configured to hold a substrate horizontally; a driving unit configured to rotate the holding unit around a vertical axis; a nozzle configured to supply a processing liquid onto the substrate which is rotated while being held by the holding unit; and a cup configured to receive the processing liquid supplied onto the substrate, wherein the cup comprises a top opening at a central top end portion thereof and an exhaust port through which an inside of the cup is exhausted, the cup further comprises a ring-shaped first exhaust space in contact with the top opening, and a ring-shaped second exhaust space which is in contact with the exhaust port and is disposed adjacent to the first exhaust space, the ring-shaped first exhaust space and the ring-shaped second exhaust space communicate with each other intermittently or continuously along an entire circumference thereof, the ring-shaped first exhaust space has a ring-shaped liquid reservoir configured to receive the processing liquid supplied onto the substrate, a ring-shaped guide wall, which is configured to separate the ring-shaped first exhaust space from the ring-shaped second exhaust space and guide the processing liquid supplied onto the substrate toward the liquid reservoir, is provided, a ring-shaped isolation wall, which is configured to separate the ring-shaped first exhaust space from the ring-shaped second exhaust space and suppress the processing liquid received in the liquid reservoir from being introduced into the ring-shaped second exhaust space, is provided, the cup further comprises an inner wall configured to confine an inner periphery portion of the ring-shaped second exhaust space, and the inner wall comprises a first wall portion serving as an upper part of the inner wall, and a second wall portion which serves as a lower part of the inner wall and is located at an inner position than the first wall portion in a radial direction, and the inner wall is located at an inner position than the ring-shaped isolation wall in the radial direction.
地址 Tokyo JP