Calibrating thermal behavior of electronics

摘要

A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.

主权项

1. A calibration method for a component dissipating heat into a coolant cooled apparatus, the method comprising:
determining a heat dissipation of said component; determining a thermal resistance from said component to a coolant; determining a measured temperature of said component according to said heat dissipation and said thermal resistance at a plurality of time stamps included in thermal data output by said component; and determining a relationship between said measured temperature and said thermal data for said component, wherein said relationship provides a calibration of said thermal data for said component to an actual temperature of said component having a workload.