发明名称 Electronic assembly
摘要 An electronic assembly includes an electronic module, a rigid board, a first flexible board, a second flexible board and a conductive adhesive layer. The first flexible board extends from the electronic module and has a first connection end and a first pad arrangement at the first connection end. The first pad arrangement has a plurality of first pads. The second flexible board is connected to the rigid board and has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement has a plurality of second pads. The first pads are structurally and electrically connected to the second pads through the conductive adhesive layer.
申请公布号 US9538655(B2) 申请公布日期 2017.01.03
申请号 US201414460357 申请日期 2014.08.15
申请人 HTC Corporation 发明人 Liu Hsin-Chih;Cheng Ying-Yen;Liao Yu-Jing
分类号 H05K1/09;H05K1/11;H05K1/14;H05K3/32;H05K3/36;H05K1/02;H05K1/00 主分类号 H05K1/09
代理机构 Jianq Chyun IP Office 代理人 Jianq Chyun IP Office
主权项 1. An electronic assembly, comprising: a first flexible board having a first connection end and a first pad arrangement at the first connection end, the first pad arrangement comprising a plurality of first pads; a second flexible board having a second connection end and a second pad arrangement at the second connection end, the second pad arrangement comprising a plurality of second pads; and a conductive adhesive layer, the first pads being structurally and electrically connected to the second pads through the conductive adhesive layer, wherein the conductive adhesive layer is adhered between the first pad arrangement and the second pad arrangement, the first pads are correspondingly laminated to the second pads, and the first pads are electrically connected to the second pads through the laminated conductive adhesive layer, and a width of the first pad is wider than a width of the corresponding second pad, and a length of the first pad is shorter than a length of the corresponding second pad.
地址 Taoyuan TW